| dc.contributor.advisor | Weichold, Mark H. | |
| dc.creator | Karunatileka, Muditha A. | |
| dc.date.accessioned | 2022-04-01T14:05:36Z | |
| dc.date.available | 2022-04-01T14:05:36Z | |
| dc.date.issued | 1986 | |
| dc.identifier.uri | https://hdl.handle.net/1969.1/CAPSTONE-KarunatilekaM_1986 | |
| dc.description | Program year: 1985/1986 | en |
| dc.description | Digitized from print original stored in HDR | en |
| dc.description.abstract | A novel method for making discretionary interconnections involves direct writing on wafer using a precision laser beam and metallization using the lift off process. After experimenting with several line thicknesses, developing times (for lift off), laser power densities and speeds, I succeeded in creating arbitrary interconnections from metal to metal, metal to diffusion and metal to polysilicon on a test structure. The feasibility of step coverage was also investigated. These results are extremely encouraging from a technical standpoint and recommendations are made which would improve this work through further research. | en |
| dc.format.extent | 34 pages | en |
| dc.format.medium | electronic | en |
| dc.format.mimetype | application/pdf | |
| dc.subject | discretionary interconnections | en |
| dc.subject | precision laser beam | en |
| dc.subject | metallization | en |
| dc.title | Direct Write Laser Lithography For Discretionary Interconnections | en |
| dc.title.alternative | DIRECT WRITE LASER LITHOGRAPHY FOR DISCRETIONARY INTERCONNECTIONS | en |
| dc.type | Thesis | en |
| thesis.degree.department | Electrical Engineering | en |
| thesis.degree.grantor | University Undergraduate Fellow | en |
| thesis.degree.level | Undergraduate | en |
| dc.type.material | text | en |
