Direct Write Laser Lithography For Discretionary Interconnections
Abstract
A novel method for making discretionary interconnections involves direct writing on wafer using a precision laser beam and metallization using the lift off process. After experimenting with several line thicknesses, developing times (for lift off), laser power densities and speeds, I succeeded in creating arbitrary interconnections from metal to metal, metal to diffusion and metal to polysilicon on a test structure. The feasibility of step coverage was also investigated. These results are extremely encouraging from a technical standpoint and recommendations are made which would improve this work through further research.
Description
Program year: 1985/1986Digitized from print original stored in HDR
Citation
Karunatileka, Muditha A. (1986). Direct Write Laser Lithography For Discretionary Interconnections. University Undergraduate Fellow. Available electronically from https : / /hdl .handle .net /1969 .1 /CAPSTONE -KarunatilekaM _1986.