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dc.contributor.advisorWalker, Duncan M.
dc.creatorXue, Bin
dc.date.accessioned2006-04-12T16:04:32Z
dc.date.available2006-04-12T16:04:32Z
dc.date.created2005-12
dc.date.issued2006-04-12
dc.identifier.urihttps://hdl.handle.net/1969.1/3211
dc.description.abstractQuiescent current leakage test of the VDD supply (IDDQ Test) has been proven an effective way to screen out defective chips in manufacturing of Integrated Circuits (IC). As technology advances, the traditional IDDQ test is facing more and more challenges. In this research, a practical built-in current sensor (BICS) is proposed and the design is verified by three generations of test chips. The BICS detects the signal by sensing the voltage drop on supply lines of the circuit under test (CUT). Then the sensor performs analog-to-digital conversion of the input signal using a stochastic process with scan chain readout. Self-calibration and digital chopping are used to minimize offset and low frequency noise and drift. This non-invasive procedure avoids any performance degradation of the CUT. The measurement results of test chips are presented. The sensor achieves a high IDDQ resolution with small chip area overhead. This will enable IDDQ of future technology generations.en
dc.format.extent1490655 bytesen
dc.format.mediumelectronicen
dc.format.mimetypeapplication/pdf
dc.language.isoen_US
dc.publisherTexas A&M University
dc.subjectIDDQen
dc.subjectBICSen
dc.titleVoltage sensing based built-in current sensor for IDDQ testen
dc.typeBooken
dc.typeThesisen
thesis.degree.departmentComputer Scienceen
thesis.degree.disciplineComputer Engineeringen
thesis.degree.grantorTexas A&M Universityen
thesis.degree.nameDoctor of Philosophyen
thesis.degree.levelDoctoralen
dc.contributor.committeeMemberLiu, Jyh-Charn
dc.contributor.committeeMemberMahapatra, Rabinarayan N.
dc.contributor.committeeMemberTaylor, Henry F.
dc.type.genreElectronic Dissertationen
dc.type.materialtexten
dc.format.digitalOriginborn digitalen


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