The R1 Conjugative Plasmid Increases Escherichia coli Biofilm Formation through an Envelope Stress Response
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Citation
Xiaole Yang; Qun Ma; Thomas K. Wood (2008). The R1 Conjugative Plasmid Increases Escherichia coli Biofilm Formation through an Envelope Stress Response. Applied and Environmental Microbiology. Available electronically from https : / /hdl .handle .net /1969 .1 /183962.