NOTE: This item is not available outside the Texas A&M University network. Texas A&M affiliated users who are off campus can access the item through NetID and password authentication or by using TAMU VPN. Non-affiliated individuals should request a copy through their local library's interlibrary loan service.
Improving the reliability of microelectronic packaging through core-shell rubber technology
| dc.creator | Weaver, Jana Lynn | |
| dc.date.accessioned | 2012-06-07T23:10:10Z | |
| dc.date.available | 2012-06-07T23:10:10Z | |
| dc.date.created | 2001 | |
| dc.date.issued | 2001 | |
| dc.identifier.uri | https://hdl.handle.net/1969.1/ETD-TAMU-2001-THESIS-W302 | |
| dc.description | Due to the character of the original source materials and the nature of batch digitization, quality control issues may be present in this document. Please report any quality issues you encounter to digital@library.tamu.edu, referencing the URI of the item. | en |
| dc.description | Includes bibliographical references (leaves 81-85). | en |
| dc.description | Issued also on microfiche from Lange Micrographics. | en |
| dc.description.abstract | The field of microelectronics is currently in high demand considering the many applications it is used for. With this demand, several concerns are raised to improve the reliability while in use. The microelectronic device is composed of numerous components, many times joined together by an epoxy-based underfill material known as the packaging. One of the critical parameters for making such miniaturized devices is the enhancement of toughness for the high performance packaging material. The core-shell rubber (CSR) particle toughening technology has been demonstrated to be effective in toughening engineering thermosets for aerospace structural applications, but little work has been published using CSR for microelectronic applications. This research focuses on utilizing this toughening technique to improve the reliability of the microelectronic package. Dynamic mechanical analysis, tensile strength, fracture toughness, coefficient of thermal expansion, and dielectric constant are all used to characterize the effect different types of CSR have on the epoxy-based underfill used for this application. The double-notch-4-point-bend test and a variety of microscopy techniques are used to understand the relationship between the deformation mechanisms and morphology. | en |
| dc.format.medium | electronic | en |
| dc.format.mimetype | application/pdf | |
| dc.language.iso | en_US | |
| dc.publisher | Texas A&M University | |
| dc.rights | This thesis was part of a retrospective digitization project authorized by the Texas A&M University Libraries in 2008. Copyright remains vested with the author(s). It is the user's responsibility to secure permission from the copyright holder(s) for re-use of the work beyond the provision of Fair Use. | en |
| dc.subject | mechanical engineering. | en |
| dc.subject | Major mechanical engineering. | en |
| dc.title | Improving the reliability of microelectronic packaging through core-shell rubber technology | en |
| dc.type | Thesis | en |
| thesis.degree.discipline | mechanical engineering | en |
| thesis.degree.name | M.S. | en |
| thesis.degree.level | Masters | en |
| dc.type.genre | thesis | en |
| dc.type.material | text | en |
| dc.format.digitalOrigin | reformatted digital | en |
Files in this item
This item appears in the following Collection(s)
-
Digitized Theses and Dissertations (1922–2004)
Texas A&M University Theses and Dissertations (1922–2004)
Request Open Access
This item and its contents are restricted. If this is your thesis or dissertation, you can make it open-access. This will allow all visitors to view the contents of the thesis.