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dc.creatorWallapapan, Kovit
dc.date.accessioned2020-08-21T21:51:15Z
dc.date.available2020-08-21T21:51:15Z
dc.date.issued1983
dc.identifier.urihttps://hdl.handle.net/1969.1/DISSERTATIONS-541481
dc.descriptionTypescript (photocopy).en
dc.format.extentxviii, 179 leavesen
dc.format.mediumelectronicen
dc.format.mimetypeapplication/pdf
dc.language.isoeng
dc.rightsThis thesis was part of a retrospective digitization project authorized by the Texas A&M University Libraries. Copyright remains vested with the author(s). It is the user's responsibility to secure permission from the copyright holder(s) for re-use of the work beyond the provision of Fair Use.en
dc.rights.urihttp://rightsstatements.org/vocab/InC/1.0/
dc.subjectSoy flouren
dc.subjectThermal diffusivityen
dc.subjectMathematical modelsen
dc.subject.lcshSoy flouren
dc.subject.lcshThermal diffusivityen
dc.subject.lcshMathematical modelsen
dc.titleMeasurement and modeling of thermal conductivity of defatted soy flour under various extrusion texturization process conditionsen
dc.typeThesisen
thesis.degree.grantorTexas A&M Universityen
thesis.degree.nameDoctor of Philosophyen
thesis.degree.namePh. Den
dc.type.genredissertationsen
dc.type.materialtexten
dc.format.digitalOriginreformatted digitalen
dc.publisher.digitalTexas A&M University. Libraries
dc.identifier.oclc11069399


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