Browsing by Subject "CMP"
Now showing items 1-7 of 7
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(2013-08-01)In chip-multiprocessor (CMP) designs, when the number of core increases, the size of on-chip communication fabric and data storage grows accordingly and therefore the chip power challenge is exacerbated. This thesis work ...
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(2009-05-15)Recently, processor power density has been increasing at an alarming rate result- ing in high on-chip temperature. Higher temperature increases current leakage and causes poor reliability. In our research, we ¯rst propose ...
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(2015-08-05)Due to chip power density limitations as well as the recent breakdown of Dennard's Scalingover the past decade, performance growth in microprocessor design has largely been driven by core scaling. These trends have led to ...
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(2009-05-15)The demand for microelectronic device miniaturization requires new concepts and technology improvement in the integrated circuits fabrication. In last two decades, Chemical-Mechanical Polishing (CMP) has emerged as the ...
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(2011-10-21)The implementation of multiple processors on a single chip has been made possible with advancements in process technology. The benefits of having multiple cores on a single chip bring with it a new set of constraints for ...
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(Texas A&M University, 2006-10-30)Research was performed to study the particle adhesion on the wafer surface after the chemical-mechanical polishing (CMP) process. The embedded particles can be abrasive particles from the slurry, debris from pad material, ...
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(2014-08-04)Chip multiprocessors (CMPs) are now popular design paradigm for microprocessors due to their power, performance and complexity advantages where a number of relatively simple cores are integrated on a single die. On chip ...