Abstract
The field of microelectronics is currently in high demand considering the many applications it is used for. With this demand, several concerns are raised to improve the reliability while in use. The microelectronic device is composed of numerous components, many times joined together by an epoxy-based underfill material known as the packaging. One of the critical parameters for making such miniaturized devices is the enhancement of toughness for the high performance packaging material. The core-shell rubber (CSR) particle toughening technology has been demonstrated to be effective in toughening engineering thermosets for aerospace structural applications, but little work has been published using CSR for microelectronic applications. This research focuses on utilizing this toughening technique to improve the reliability of the microelectronic package. Dynamic mechanical analysis, tensile strength, fracture toughness, coefficient of thermal expansion, and dielectric constant are all used to characterize the effect different types of CSR have on the epoxy-based underfill used for this application. The double-notch-4-point-bend test and a variety of microscopy techniques are used to understand the relationship between the deformation mechanisms and morphology.
Weaver, Jana Lynn (2001). Improving the reliability of microelectronic packaging through core-shell rubber technology. Master's thesis, Texas A&M University. Available electronically from
https : / /hdl .handle .net /1969 .1 /ETD -TAMU -2001 -THESIS -W302.