Photoimageable compositions and films for printed wiring board manufacture
Abstract
Compositions for forming polymeric layers useful in the manufacture printed wiring boards and other electrical interconnecting devices are disclosed. The compositions typically are processable in aqueous base and can be made photosensitive with the addition of a positive acting photosensitive compound. The compositions are particularly useful in the manufacture of laminable films used to make printed wiring boards. Multilayer printed wiring boards made using such films, and methods for making and using the films and boards, also are disclosed.
Subject
523/456257/E23.077
C08L 63/00
G03F 7/0233
G03F 7/0236
G03F 7/038
H01L 23/49894
H05K 3/4673
C08L 63/00
H01L 2924/09701
H05K 3/0023
H05K 3/4644
H05K 2201/0195
H05K 2203/066
C08L 2666/02
H01L 2924/0002
H01L 2924/00
Collections
Citation
Sinclair, David P.; Fjare, Douglas E.; Hoback, John T.; Vankirk, Terre L.; Rubis, Donald E.; Wargowski, David A.; Liu, Wen-Feng; Sanchez, Paul A. (2002). Photoimageable compositions and films for printed wiring board manufacture. United States. Patent and Trademark Office; Texas A&M University. Libraries. Available electronically from https : / /hdl .handle .net /1969 .1 /176707.