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dc.contributor.advisorNguyen, Cam
dc.creatorKim, Kyoungwoon
dc.date.accessioned2016-07-08T15:14:11Z
dc.date.available2018-05-01T05:49:12Z
dc.date.created2016-05
dc.date.issued2016-04-13
dc.date.submittedMay 2016
dc.identifier.urihttps://hdl.handle.net/1969.1/157017
dc.description.abstractThis dissertation presents new circuit architectures and techniques for designing high performance microwave and millimeter-wave circuits using 0.18-µm SiGe BiCMOS process for advanced wireless communication and sensing systems. The high performance single- and multi-band power amplifiers working in microwave and millimeter-wave frequency ranges are proposed. A 10-19, 23-39, and 33-40 GHz concurrent tri-band power amplifier in the respective Ku-, K-, and Ka-band using the distributed amplifier structure is presented first. Instead of utilizing multi-band matching networks, this amplifier is realized based on distributed amplifier structure and two active notch filters employed at each gain cell to form tri-band response. In addition, a power amplifier operating across the entire K-band is proposed. By employing lumped-element Wilkinson power divider and combiner, it produces high output power, high gain, and power added efficiency characteristics over broadband due to its inherent low-pass filtering response. Moreover, a highly integrated V-band power amplifier is presented. This power amplifier consists of four medium unit power cells combined with a four-way parallel power combining network. Secondly, microwave and millimeter-wave power combining and dividing networks are proposed. A wideband power divider and combiner operating up to 67 GHz is developed by adopting capacitive loading slow-wave transmission line to reduce size as well as insertion loss. Also, two-way and 16-way 24/60 GHz dual-band power divider networks in the K/V-band are proposed. The two-way dual-band power divider is realized with a slow-wave transmission line and two shunt connected LC resonators in order to minimize the chip size as well as insertion loss. Furthermore, a 16-way dual-band power dividing and combining network is developed for a dual-band 24/60 GHz 4×4 array system. This network incorporates a two-way dual-band power divider, lumped-element based Wilkinson power dividers, and multi-section transmission line based Wilkinson structures. Finally, a K-/V-band dual-band transmitter front-end is proposed. To realize the transmitter, a diplexer with good diplexing performance and K- and V-band variable gain amplifiers having low phase variation with gain tuning are designed. The transmitter is integrated with two diplexers, K- and V-band variable gain amplifiers, and two power amplifiers resulting in high gain, high output power, and low-phase variation with all gain control stages.en
dc.format.mimetypeapplication/pdf
dc.language.isoen
dc.subjectmicrowaveen
dc.subjectmillimeter-waveen
dc.subjectRFICen
dc.subjecttransmitteren
dc.titleMicrowave and Millimeter-Wave Multi-Band Power Amplifiers, Power Combining Networks, and Transmitter Front-End in Silicon Germanium BiCMOS Technologyen
dc.typeThesisen
thesis.degree.departmentElectrical and Computer Engineeringen
thesis.degree.disciplineElectrical Engineeringen
thesis.degree.grantorTexas A & M Universityen
thesis.degree.nameDoctor of Philosophyen
thesis.degree.levelDoctoralen
dc.contributor.committeeMemberKish, Laszlo B
dc.contributor.committeeMemberEntesari, Kamran
dc.contributor.committeeMemberMohanty, Binayak
dc.type.materialtexten
dc.date.updated2016-07-08T15:14:11Z
local.embargo.terms2018-05-01
local.etdauthor.orcid0000-0001-8120-8935


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