Browsing by Subject "EPON 862"
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Thermodynamic and mechanical properties of EPON 862 with curing agent DETDA by molecular simulation (2009-05-15)Fully atomistic molecular dynamics (MD) simulations were used to predict the properties of EPON 862 cross-linked with curing agent DETDA, a potentially useful epoxy resin for future applications of nanocomposites. The ...