Browsing by Author "Ng, Dedy"

Now showing items 1-2 of 2

    • Interfacial forces in chemical-mechanical polishing 
      Ng, Dedy (2009-05-15)
      The demand for microelectronic device miniaturization requires new concepts and technology improvement in the integrated circuits fabrication. In last two decades, Chemical-Mechanical Polishing (CMP) has emerged as the ...
    • Nanoparticles removal in post-CMP (Chemical-Mechanical Polishing) cleaning 
      Ng, Dedy (Texas A&M University, 2006-10-30)
      Research was performed to study the particle adhesion on the wafer surface after the chemical-mechanical polishing (CMP) process. The embedded particles can be abrasive particles from the slurry, debris from pad material, ...