Flexible and compliant thermal interface materials with ultrahigh thermal conductivities
Abstract
Inefficient dissipation of heat limits the performance of electronic devices. Thermal interface materials (TIMs) can be used in electronic devices to dissipate heat more effectively and efficiently. Nanocomposites have been prepared using functionalized boron nitride nanosheets (BNNS). The incorporation of soft-ligand functionalized BNNS in a metal matrix was used to nanofabricate kinetically-trapped nanocomposites TIMs.
Subject
C25D 15/00B32B 9/00
C09K 5/14
C25D 3/38
C25D 7/00
F28F 13/00
H01L 23/3731
H01L 23/3736
H01L 23/42
H05K 7/2039
B82Y 30/00
B82Y 40/00
F28F 2013/001
H01L 23/3373
H01L 24/27
H01L 24/29
H01L 24/32
H01L 2224/27462
H01L 2224/2939
H01L 2224/29209
H01L 2224/29239
H01L 2224/29247
H01L 2224/29386
H01L 2224/32245
H01L 2924/1432
Y10S 977/755
Y10S 977/778
Y10S 977/90
Y10S 977/932
Collections
Citation
Akbulut, Mustafa; Yegin, Cengiz; Nagabandi, Nirup K.; Teipel, Blake (2020). Flexible and compliant thermal interface materials with ultrahigh thermal conductivities. United States. Patent and Trademark Office; Texas A&M University. Libraries. Available electronically from https : / /hdl .handle .net /1969 .1 /188826.