Browsing by Subject "257/E23.088"

Now showing items 1-4 of 4

    • Bellows heat pipe for thermal control of electronic components 
      Peterson, George P.; Oktay, Sevgin (United States. Patent and Trademark Office; Texas A&M University. Libraries, 1990-08-28)
      A bellows type heat pipe which conducts heat away from an electronic device to a heat sink. The heat pipe is a sealed bellows type container which has an evaporator section at one end and a condenser section at an opposite ...
    • Method for producing micro heat panels 
      Camarda, Charles J.; Peterson, George P.; Rummler, Donald R. (United States. Patent and Trademark Office; Texas A&M University. Libraries, 1997-02-04)
      Flat or curved micro heat pipe panels are fabricated by arranging essentially parallel filaments in the shape of the desired panel. The configuration of the filaments corresponds to the desired configuration of the tubes ...
    • Micro heat pipe panels and method for producing same 
      Camarda, Charles J.; Peterson, George P.; Rummler, Donald R. (United States. Patent and Trademark Office; Texas A&M University. Libraries, 1996-06-18)
      Flat or curved micro heat pipe panels are fabricated by arranging essentially parallel filaments in the shape of the desired panel. The configuration of the filaments corresponds to the desired configuration of the tubes ...
    • Vapor deposited micro heat pipes 
      Weichold, Mark H.; Peterson, George P.; Mallik, Arnab K. (United States. Patent and Trademark Office; Texas A&M University. Libraries, 1993-01-12)
      A micro heat pipe, formed in a semiconductor substrate, carries heat from a region of heat flux in the substrate to a region of lower heat flux. The micro heat pipe is formed by cutting a groove into the substrate opposite ...