Fourth optical inspection of integrated circuits using image processing and mathematical morphology: a report
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Date
2013-03-13
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Texas A&M University
Abstract
As competition gets tighter in the industrial world, many manufacturers
are switching from the classical labor intensive methods of production to more sophisticated
techniques using automation. At the microprocessor division of Motorola Inc. this approach was
taken in a systematic manner. An automation group was founded with the ultimate goal of
automating the testing procedures of their product. This testing procedure consists of two
major tasks. First an electrical test is performed on the microprocessors to insure that they
meet the required electrical specifications. Second a visual inspection of the packages is
undertaken to reject the parts with surface flows, such as bubbles, blisters, chips, cracks,
and voids. The latter inspection will be of interest to us in this dissertation. The purpose
of this work is to perform the visual inspection automatically. The method used is image
processing. In particular mathematical morphology is viable because it is the study of shapes.
As we will find in this report, defects are merely abnormal shapes of the
packages.
Description
"Submitted to the Graduate College of Texas A&M University in partial
fulfillment of the requirement for the degree of Doctor of Engineering."
Includes bibliographical references
Includes bibliographical references
Keywords
Major Electrical Engineering, Electrical Engineering