Short time scale thermal mechanical shock wave propagation in high performance microelectronic packaging configuration

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dc.contributor.advisorSuh, Chii-Der
dc.contributor.committeeMemberAnand, Nagamangala K.
dc.contributor.committeeMemberKuo, Yue
dc.creatorNagaraj, Mahavir
dc.date.accessioned2004-11-15T19:45:57Z
dc.date.available2004-11-15T19:45:57Z
dc.date.created2004-08
dc.date.issued2004-11-15
dc.description.abstractThe generalized theory of thermoelasticity was employed to characterize the coupled thermal and mechanical wave propagation in high performance microelectronic packages. Application of a Gaussian heat source of spectral profile similar to high performance devices was shown to induce rapid thermal and mechanical transient phenomena. The stresses and temporal gradient of stresses (power density) induced by the thermal and mechanical disturbances were analyzed using the Gabor Wavelet Transform (GWT). The arrival time of frequency components and their magnitude was studied at various locations in the package. Comparison of the results from the classical thermoelasticity theory and generalized theory was also conducted. It was found that the two theories predict vastly different results in the vicinity of the heat source but that the differences diminish within a larger time window. Results from both theories indicate that the rapid thermal-mechanical waves cause high frequency, broadband stress waves to propagate through the package for a very short period of time. The power density associated with these stress waves was found to be of significant magnitude indicating that even though the effect, titled short time scale effect, is short lived, it could have significant impact on package reliability. The high frequency and high power density associated with the stress waves indicate that the probability of sub-micron cracking and/or delamination due to short time scale effect is high. The findings demonstrate that in processes involving rapid thermal transients, there is a non-negligible transient phenomenon worthy of further investigation.en
dc.format.digitalOriginborn digitalen
dc.format.extent14653004 bytesen
dc.format.extent123309 bytesen
dc.format.mediumelectronicen
dc.format.mimetypeapplication/pdf
dc.format.mimetypetext/plain
dc.identifier.urihttps://hdl.handle.net/1969.1/1087
dc.language.isoen_US
dc.publisherTexas A&M University
dc.subjectelectronic packagingen
dc.subjectthermal mechanicalen
dc.subjectthermomechanicalen
dc.subjectflip chipen
dc.subjectshock waveen
dc.subjectreliabilityen
dc.subjectgreen lindsayen
dc.subjectgeneralized thermoelasticityen
dc.titleShort time scale thermal mechanical shock wave propagation in high performance microelectronic packaging configurationen
dc.typeBooken
dc.typeThesisen
dc.type.genreElectronic Thesisen
dc.type.materialtexten
thesis.degree.departmentMechanical Engineeringen
thesis.degree.disciplineMechanical Engineeringen
thesis.degree.grantorTexas A&M Universityen
thesis.degree.levelMastersen
thesis.degree.nameMaster of Scienceen

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