Teleoperated Positioning and Microscopy System for Diagnostic Single-event Effects Testing of Integrated Circuits
| dc.contributor.advisor | Fink, Rainer J | |
| dc.contributor.committeeMember | Song, Xingyong | |
| dc.contributor.committeeMember | Silva-Martinez, Jose | |
| dc.creator | Wedelich, Jackson Douglas | |
| dc.date.accessioned | 2024-06-11T21:53:34Z | |
| dc.date.available | 2024-06-11T21:53:34Z | |
| dc.date.created | 2021-12 | |
| dc.date.issued | 2021-12-08 | |
| dc.date.submitted | December 2021 | |
| dc.date.updated | 2024-06-11T21:53:35Z | |
| dc.description.abstract | The semiconductor industry is engaged in a process of innovation for space applications. Trends in space exploration and satellite technology are driving requirements for processing power higher and constraints for integrated circuit (IC) size lower. The processes for characterization and testing for radiation hardness of semiconductor devices, governed by the United States Department of Defense, remains focused on single-event effects and total ionizing dose at the level of an entire IC. Though these standards effectively give consumers the information and quality they need, simply testing to these standards does not enable effective innovation for designers of the devices. In the process of characterizing the radiation hardness of ICs, it is useful to isolate radiation exposure to individual functional blocks within a circuit. This radiation isolation testing can lead to discoveries of varying vulnerabilities in functional blocks of an IC. Radiation isolation testing is time consuming and costly because of the tedious process and repetitive actions required. This project combines mechanization of the existing process with remote operation capabilities to reduce repetitive actions and expand the capabilities of radiation isolation testing. This document covers the requirements of the system and its successful implementation. | |
| dc.format.mimetype | application/pdf | |
| dc.identifier.uri | https://hdl.handle.net/1969.1/201380 | |
| dc.language.iso | en | |
| dc.subject | microscope | |
| dc.subject | radiation testing | |
| dc.subject | single-event effects | |
| dc.subject | positioning system | |
| dc.subject | electronics | |
| dc.subject | integrated circuits | |
| dc.subject | semiconductor | |
| dc.subject | engineering | |
| dc.title | Teleoperated Positioning and Microscopy System for Diagnostic Single-event Effects Testing of Integrated Circuits | |
| dc.type | Thesis | |
| dc.type.material | text | |
| local.etdauthor.orcid | 0000-0001-5493-0682 | |
| thesis.degree.department | Engineering Technology and Industrial Distribution | |
| thesis.degree.discipline | Engineering Technology | |
| thesis.degree.grantor | Texas A&M University | |
| thesis.degree.level | Masters | |
| thesis.degree.name | Master of Science |