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    • Flexible and compliant thermal interface materials with ultrahigh thermal conductivities 

      Akbulut, Mustafa; Yegin, Cengiz; Nagabandi, Nirup K.; Teipel, Blake (United States. Patent and Trademark OfficeTexas A&M University. Libraries, 8/4/2020)
      Inefficient dissipation of heat limits the performance of electronic devices. Thermal interface materials (TIMs) can be used in electronic devices to dissipate heat more effectively and efficiently. Nanocomposites have ...