Browsing by Subject "257/E21.305"

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    • Forming an interconnect of a semiconductor device 
      Kuo, Yue (United States. Patent and Trademark Office; Texas A&M University. Libraries, 2003-09-02)
      Forming an interconnect of a semiconductor device includes defining a recessed structure proximate to an outer surface of a substrate of a semiconductor device. A metal layer is deposited within the recessed structure. A ...