Application of micro-heat pipes for the thermal control of semiconductor devices
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Electronic components produce heat that hinders their performance and reliability. Heat pipes, two-phase heat transfer devices, may be used to effectively cool electronic components. This project focuses on two different heat pipe designs that may potentially be used to cool electronic components. One heat pipe design being studied uses metal wires to form its wicking structure. This simple wick design may result in reduced manufacturing costs. The second heat pipe design has a wick pattern formed in a copper plate. The wick pattern is designed to separate the flow of vapor and liquid within the heat pipe. To evaluate both heat pipe designs, test articles were fabricated and tested to determine their heat transfer performance. Tests performed in this study indicated that both heat pipe designs offered no performance benefits when compared to comparable solid conductors. Errors in the charging process and use of improper amounts of working fluid are believed to cause the negligible performance gains.
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Includes bibliographical references (leaf 29).
Corbett, Brian Patrick (2000). Application of micro-heat pipes for the thermal control of semiconductor devices. Texas A&M University. Available electronically from