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dc.contributor.advisorLau, Sai C.
dc.creatorAchanta, Vamsee Satish
dc.date.accessioned2004-09-30T01:43:31Z
dc.date.available2004-09-30T01:43:31Z
dc.date.created2003-05
dc.date.issued2004-09-30
dc.identifier.urihttps://hdl.handle.net/1969.1/140
dc.description.abstractIn this work, we study the enhanced endwall heat transfer for flow past non conducting pin fin arrays. The aim is to resolve the controversy over the heat transfer that is taking place from the endwall and the pin surface.Various parameters were studied and results were obtained. Our results are found to be consistent with some of the results that have been previously published. The results were surprisingly found to be dependent on the height of the pin fin.en
dc.format.extent704731 bytesen
dc.format.extent42804 bytesen
dc.format.mediumelectronicen
dc.format.mimetypeapplication/pdf
dc.format.mimetypetext/plain
dc.language.isoen_US
dc.publisherTexas A&M University
dc.subjectEndwall Heat Transfer for Pin Fin Arraysen
dc.titleAn experimental study of endwall heat transfer enhancement for flow past staggered non-conducting pin fin arraysen
dc.typeBooken
dc.typeThesisen
thesis.degree.departmentMechanical Engineeringen
thesis.degree.disciplineMechanical Engineeringen
thesis.degree.grantorTexas A&M Universityen
thesis.degree.nameMaster of Scienceen
thesis.degree.levelMastersen
dc.contributor.committeeMemberHassan, Y. A.
dc.contributor.committeeMemberAnand, N. K.
dc.type.genreElectronic Thesisen
dc.type.materialtexten
dc.format.digitalOriginborn digitalen


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