Browsing by Subject "Electromigration"
Now showing items 1-2 of 2
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(2019-08-14)Copper (Cu) interconnect lines are widely used in advanced, high-density integrated circuits (ICs), large-area flat panel displays, and many nano and microelectronic and optoelectronic products. Compared with aluminum (Al), ...
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(2018-03-20)In this work, we integrate different computational tools based on multi-phase-field simulations to account for the evolution of morphologies and crystallographic defects of Cu/Sn/Cu sandwich interconnect structures that ...